Demonstrates excellence in the primary grinding of as deposition and as-sliced wafers
- A vitrified bond wheel having high grain holding power. The high porosity structure and the characteristic grain layer shape realize low grinding resistance and create a new grinding region.
- “Nanomate” capable of creating a flatness below 1 μm with Φ300-mm silicon wafers enables grinding of brittle materials used for semiconductor and electronic parts that have been difficult to grind with conventional wheels.
Characteristics
- The grinding resistance is about one tenth of the resin bond wheel. Fine abrasive grains yet high efficiency and low-load grinding is realized. The V-shape that allows the setting of optimum grain spacing ensures long-lasting sharpness.
