A.L.M.T.

Vitrified bond wheels – for silicon wafer rough grinding

Nanomate V-Heart

 

A vitrified bond wheel having high grain holding power. The high porosity structure and the characteristic grain layer shape realize low grinding resistance and create a new grinding region.

SKU: Nanomate V-Heart Categories: ,

Demonstrates excellence in the primary grinding of as deposition and as-sliced wafers

A vitrified bond wheel having high grain holding power. The high porosity structure and the characteristic grain layer shape realize low grinding resistance and create a new grinding region.
“Nanomate” capable of creating a flatness below 1 μm with Φ300-mm silicon wafers enables grinding of brittle materials used for semiconductor and electronic parts that have been difficult to grind with conventional wheels.

 

Characteristics


  • The grinding resistance is about one tenth of the resin bond wheel. Fine abrasive grains yet high efficiency and low-load grinding is realized. The V-shape that allows the setting of optimum grain spacing ensures long-lasting sharpness.

Applications


Primary grinding of as deposition and as-sliced wafers, etc. 

Industries


  • Semiconductor/electronics
 

Work Material


  • Semiconductor material
 

Processing Method


  • Surface grinding
  • double-ended surface grinding

ENQUIRY

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Product Name : Vitrified bond wheels – for silicon wafer rough grinding