A.L.M.T.

Vitrified bond wheels – for GaN wafer grinding

Nanomate Premium

 

The adjustment of the binding grade and bond has enabled grinding of difficult-to-cut materials with fine grains that have been difficult to grind with conventional wheels.

SKU: Nanomate Premium GaN Categories: ,

Effective for shortening the polishing time!

The adjustment of the binding grade and bond has enabled grinding of difficult-to-cut materials with fine grains that have been difficult to grind with conventional wheels. This wheel ensures high-speed and mirror finishing of GaN wafers.

Applications


Precision surface grinding of GaN wafers 

Industries


  • Semiconductor/electronics
 

Work Material


  • Semiconductor material
 

Processing Method


  • Surface grinding

ENQUIRY

Lorem Lorem ipsum dolor sit amet, conse ctetur adipiscing elit, sed do eiusmod tempor incididunt ut labore

Product Name : Vitrified bond wheels – for GaN wafer grinding