A.L.M.T.

Vitrified bond wheels – for SiC wafer finishing

Nanomate Premium

 

Continuous grinding of single crystal SiC wafers that are difficult to grind with other wheels but this wheel is possible. It can grind at the same feed rate as for Si wafers and ultra-smooth surfaces can be produced.

SKU: Nanomate Premium Categories: ,

High efficiency and high quality grinding of SiC wafers realized.

The grain spacing required for good biting of workpieces while maintaining the strength has been realized by bonding diamond grains and vitrified bond at an appropriate ratio.
Continuous grinding of single crystal SiC wafers that have been difficult to grind with convectional wheels is now possible.
In particular, the wheel that uses superabrasive grains enables grinding at the same feed rate as when grinding silicon wafers and ultra-smooth surfaces can be produced.

 

Characteristics


  • Continuous grinding of single crystal SiC wafers is possible. High quality grinding shortens the post-process CMP time significantly.

Applications


Ultra-precision surface grinding of various semiconductor wafers 

Industries


  • Semiconductor/electronics
 

Work Material


  • Semiconductor material
 

Processing Method


  • Surface grinding

ENQUIRY

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Product Name : Vitrified bond wheels – for SiC wafer finishing