Achieved low damage processing of LT (lithium tantalite) wafers
- Because fragile LT wafers used as the SAW filter tend to get broken in processing, improving the surface roughness of machined surfaces is required.
- “Nanomate Premium,” having a high porosity abrasive layer with excellent durability of sharpness, provides low damage machining by the added body shape with a function of efficiently feeding to the grinding point.
Characteristics
- The high porosity abrasive layer ensures long-lasting sharpness. The newly developed body shape allows uniform supply of grinding fluid to grinding points. High efficiency and high quality grinding is now possible.
