Demonstrates excellence in the final mirror finishing and grinding of wafers, lap wafers, and device BG
- Superfine diamond and superfine ceramics changed the concept of the grinding wheel. Putting together our cultivated essence of material technology and production technology, we enabled ultrafine grinding.
- It demonstrates effectiveness in reducing the damaged layer and strain layer during fragile material machining such as polish reduction of ? 300 mm silicon wafers and cracking suppression of thinning device wafers.
Characteristics
- High flatness and ultra-smooth grinding realized: GBIR 0.2 μm – Ra 2.5 nm. Depth of damage on ground surface 0.12 μm. Strain layer one tenth of the general purpose resin spec. Grinding of thickness as thin as 3 μm of 300-mm silicon wafers possible.
